Haufinyane tjena, sehlopha sa lipatlisiso sa Ye Zhenhua, moprofesa oa Key Laboratory ea Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, e phatlalalitse sengoloa sa tlhahlobo mabapi le "Frontiers of infrared photoelectric detectors and innovation Trend" koranteng ea Infrared le millimeter-wave.
Boithuto bona bo shebane le boemo ba lipatlisiso tsa theknoloji ea infrared lapeng le kantle ho naha, 'me e tsepamisitse maikutlo ho libaka tsa hajoale tsa lipatlisiso le mekhoa ea kamoso ea nts'etsopele ea li-infrared photoelectric detectors.Taba ea pele, ho hlahisoa mohopolo oa SWaP3 bakeng sa ho ata ha maqheka le ts'ebetso e phahameng ea maano.Taba ea bobeli, ho hlahlojoa li-photodetectors tse tsoetseng pele tsa moloko oa boraro tse nang le tharollo ea sebaka se phahameng haholo, tharollo ea matla a phahameng ka ho fetesisa, tharollo ea nako e phahameng haholo le tharollo ea pono e phahameng haholo, 'me ho hlahlojoa litšobotsi tsa tekheniki le mekhoa ea ts'ebetsong ea lisebelisoa tsa infrared tse phephetsang moeli. ea matla a ho lemoha matla a khanya ea hlahlojoa.Joale, moloko oa bone oa moloko oa bone oa infrared photoelectric detector e thehiloeng ho micro-structure ea maiketsetso e buisanoa, 'me mekhoa ea ho lemoha le mathata a tekheniki a fusion ea tlhahisoleseding ea mefuta e mengata e kang polarization, spectrum le phase li hlahisoa haholo-holo.Qetellong, ho latela pono ea ntlafatso ea dijithale ea on-chip ho ea ho bohlale ba on-chip, ho buisanoa ka phetoho ea nako e tlang ea li-detectors tsa infrared.
Ka nts'etsopele ea Artificial intelligence of Things (AIoT) mokhoa o tumme ka potlako mafapheng a fapaneng.Ho lemoha ka mokhoa o kopaneng le ts'ebetso e bohlale ea tlhaiso-leseling ea infrared ke eona feela tsela ea hore theknoloji ea ho lemoha ha infrared e tuma le ho ntlafatsoa mafapheng a mangata.Li-detectors tsa infrared li ntse li tsoela pele ho tloha ho sensor e le 'ngoe ho ea ho litšoantšo tsa fusion ea lintlha tse ngata le lisebelisoa tse bohlale tsa infrared photoelectric ho chip.Ho ipapisitsoe le moloko oa bone oa li-photodetectors tsa infrared tse kopantsoeng le li-microstructures tsa maiketsetso tsa ho feto-fetoha ha lebala la leseli, mochine o fetolang setšoantšo sa infrared bakeng sa ho fumana tlhahisoleseding ea on-chip infrared, ho sebetsana le matšoao le ho etsa liqeto ka bohlale e hlahisoa ke 3D stacking.Ho ipapisitsoe le ts'ebetso ea on-chip le theknoloji ea ts'ebetso e bohlale, sets'oants'o se secha sa tlhaiso-leseling se bohlale se na le litšoaneleho tsa palo ea pixel ea on-chip, tlhahiso e ts'oanang le ts'ebeliso e tlase ea matla e ipapisitseng le ts'ebetso e tsamaisoang ke ketsahalo, e ka ntlafatsang haholo ho bapisa, ho bala mohato le ho feta. boemo bo bohlale ba ho ntša likarolo le lisebelisoa tse ling tsa ho lemoha photoelectric.
Nako ea poso: Mar-23-2022